This position involves mechanical testing and characterization for package R&D in the semiconductor field at Sandisk Shanghai.
This Job will focus on Sandisk Shanghai package R&D lab mechanical test and characterization, including but not limit to following items in semiconductor field.
1) Package, chip and PCB warpage test
2) Die and package mechanical strength test
3) DMA (Dynamic mechanical analysis) and TMA (Thermal mechanical analysis) test
4）Nanoindentation test and other lab test
5) other lab related testing
The candidate should have bachelor's degree in mechanical material Engineering or similar background and have basic knowledge in mechanical and material test. additional requirement including:
1) Do thing in an attentive and dedicated manner
2) Be committed and down-to-earth
3) Be studious and positive
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
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