Technician 2, Manufacturing Equipment (Die Prep)

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Be responsible for Die Prep equipment day to day line sustaining, PM and conversion.
• Able to hands on and provide systematic problem analysis.
• Ability to troubleshoot, analyze complex problems and 5 WHY analysis.
• Be available for overtime work as of when needed.
• Experience in PM and major down troubleshooting.
• Responsible to liaise with process engineering team for low yield triggering.

REQUIRED:

• Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent.
• 1~3 years of equipment engineering experience in Wafer soft test equipment maintenance.

PREFERRED:

• Knowledge in Backgrind, wafer saw and Taping will be added advantage.
• Die Prep equipment maintenance and troubleshooting skill, wafer handling skill and involve in some improvement project.

SKILLS:

• Able to do troubleshooting and maintenance at Die Prep equipment, hands on and provide systematic problem analysis.
• Able to perform Preventive maintenance, conversion. and quality improvement projects.

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