We are seeking an experienced Senior Substrate Designer to support the development of advanced IC packaging solutions. In this role, you will design high performance substrates that enable next generation semiconductor products. You will work closely with design engineering test engineering and operations teams to ensure high quality manufacturable solutions that meet electrical mechanical and thermal requirements.
Key Responsibilities
Substrate Design and Layout
- Create complex multi layer substrate designs for high speed mixed signal and power ICs
- Develop detailed layout including routing stackups via structures and design rules
- Optimize layouts for signal integrity power integrity and thermal performance
Cross Functional Collaboration
- Partner with IC design teams to understand die level requirements and translate them to substrate architecture
- Work with packaging operations suppliers and manufacturing partners to ensure design feasibility and high yield
- Collaborate with test and product engineering to support bring up qualification and debug
Technical Ownership
- Define substrate design guidelines standards and best practices
- Conduct design reviews and provide expert guidance on tradeoffs and constraints
- Create and maintain documentation including drawings BOMs and release files
Analysis and Validation
- Perform signal integrity power integrity and thermal simulations as needed
- Validate layout decisions with modeling and characterization data
- Support root cause analysis for substrate related issues in development and production
Required Qualifications
- Bachelor’s degree in electrical engineering, Mechanical Engineering, Materials Engineering or related field
- 5+ years of experience in substrate design or advanced IC packaging
- Strong expertise with substrate CAD tools such as Cadence Allegro or equivalent
- Deep understanding of high speed routing impedance control stackup design via structures and manufacturing constraints
- Knowledge of SI and PI fundamentals including loss crosstalk return paths and decoupling strategies
- Experience working with OSATs and substrate vendors
Preferred Qualifications
- Experience with advanced packaging technologies such as flip chip 2.5D 3D or chiplet architectures
- Familiarity with thermal modeling and materials selection
- Strong documentation and communication skills
- Ability to work effectively in a fast paced collaborative environment
Benefits
- 100% Employer Paid Health Insurance (Medical, Dental, Vision)
- Unlimited Paid Time Off
- Performance Bonuses
- Free Lunch Catered in by Local Restaurants
- Private Equity Options
- Retirement Plans
- Sabbatical Program
- Tuition Reimbursement
- Volunteer Days
- Relocation Assistance
- Conference Attendance Support
- Biweekly Phone Stipend
- Employee Assistance Program
The salary range for this role is $115,000.00-$130,000.00. The final compensation will depend on your experience, skill set, and how well you're able to highlight your background throughout the interview process.
