Senior Signal Integrity / Power Integrity (SI/PI) Engineer

Who You'll Work With

Arista’s cutting-edge Ethernet and optical networking platforms are built to push the limits of performance, density, and power efficiency. This wouldn’t be possible without our Signal Integrity (SI) and Power Integrity (PI) engineers who design, simulate, and characterize interconnects enabling the fastest SerDes technologies in the industry. We’re looking for a Senior Signal Integrity / Power Integrity Hardware Engineer to join our Hardware Design team in Bangalore, Karnataka. In this role, you’ll work at the intersection of advanced simulation, next-generation SerDes (112G/224G/448G PAM4), and innovative routing, packaging, and power delivery techniques. Your work will directly influence the architecture and layout of Arista’s next-generation Ethernet and optical systems for hyperscale, AI, and cloud networking.

What You'll Do

• Lead SI and PI efforts for high-speed electrical and optical interconnects across Arista’s Ethernet platforms, optical transceiver modules, and high-density optical engines.
• Perform 3D EM design and simulation of high-speed interconnects (channels, vias, packages, and connectors) for 112G/224G/448G PAM4 SerDes using tools such as Ansys HFSS, SiWave, Keysight ADS, Cadence Sigrity, CST, and SiSoft QSI.
• Develop and validate test vehicles to characterize next-generation PCB materials, packages, and interconnects.
• Conduct S-parameter and time-domain measurements (VNA, TDR, BERT, eye diagram, jitter, BER) to extract channel performance and validate modeling correlation.
• Perform link-level analysis for advanced standards (Ethernet 800G/1.6T, PCIe Gen6/Gen7, CXL) using tools such as Keysight ADS or Cadence SystemSI.
• Design and optimize PCB stackups, via structures, breakout regions, and connector transitions to meet compliance with IEEE, CEI, and MSA standards.
• Work closely with hardware, mechanical, optical, ASIC, and packaging teams to optimize stack-up, breakout, and routing strategies for high-density designs and ensure manufacturability and reliability.
• Define routing constraints, reference plane designs, and return path continuity for minimal signal degradation.
• Design and optimize PDNs to meet target impedance, minimize noise coupling, and support fast transient loads for high-speed DSPs and ICs.
• Provide SI/PI layout guidelines to PCB designers and review placement/routing for high-speed paths and power domains.
• Research and prototype novel materials, backplane concepts, and low-loss interconnect topologies to meet next-generation performance targets.
• Support bring-up and debug of production boards, working cross-functionally to root-cause SI/PI-related issues.
• Engage with ASIC, connector, and packaging vendors to support co-design and channel optimization across multiple integration layers.
• Drive root cause analysis of SI/PI-related issues during validation and production builds.

• B.S. or higher in Electrical Engineering, Applied Physics, or a related field with emphasis on electromagnetics, signal integrity, power integrity, or high-speed digital design.
• 7+ years of experience in SI/PI engineering for high-speed interconnects in optical, networking, or high-performance hardware systems.
• Solid understanding of signal integrity theory, S-parameter analysis, and channel modeling.
• Proven experience with 56G/112G/224G/448G PAM4 and NRZ serial links and related SI/PI challenges.
• Hands-on experience with 2.5D/3D EM solvers (Ansys HFSS, SiWave, Sigrity, CST, ADS).
• Strong lab skills using oscilloscopes, VNAs, TDRs, BERTs, and Ethernet compliance tools.
• Strong understanding of PCB stackup design, via modeling, impedance control, and crosstalk mitigation.
• Familiarity with advanced PCB materials (e.g., Megtron 7, Tachyon 100G, SLP) and manufacturing constraints for high-speed design.
• Experience with power delivery design, including decoupling strategies, PDN impedance analysis, and noise mitigation techniques.
• Knowledge of power integrity and co-simulation techniques.
• Familiarity with transceiver MSA form factors (QSFP-DD, OSFP) and standards from IEEE, CEI, and OIF.
• Excellent communication, collaboration, and documentation skills.

Preferred Qualifications

• M.E./ M.S. in Electrical Engineering or related field with emphasis on high-speed or mixed-signal systems.
• Experience with co-packaged optics, chiplet-based architectures, or advanced substrate technologies.
• Familiarity with EMI/EMC considerations and signal/power isolation in densely integrated photonic-electronic systems.
• Understanding of thermal and mechanical effects on SI/PI performance and long-term reliability.
• Experience working with fabrication vendors, ASIC teams, and contract manufacturers to ensure end-to-end channel integrity.

Arista stands out as an engineering-centric company. Our leadership, including founders and engineering managers, are all engineers who understand sound software engineering principles and the importance of doing things right.
We hire globally into our diverse team. At Arista, engineers have complete ownership of their projects. Our management structure is flat and streamlined, and software engineering is led by those who understand it best. We prioritize the development and utilization of test automation tools.
Our engineers have access to every part of the company, providing opportunities to work across various domains. Arista is headquartered in Santa Clara, California, with development offices in Australia, Canada, India, Ireland, and the US. We consider all our R&D centers equal in stature.
Join us to shape the future of networking and be part of a culture that values invention, quality, respect, and fun.