Senior Engineer, Wire Bond Process Dev Engineering

ROLE SUMMARY

Wire Bond Process Engineer is responsible for developing, optimizing, and sustaining wire bond processes to support new product introduction (NPI), yield improvement, and high‑volume manufacturing. This role works closely with cross‑functional teams to ensure robust process capability, strong quality performance, and smooth technology transitions.

ESSENTIAL DUTIES AND RESPONSIBILITES:

• Define process windows and establish recipe baselines for Wire Bond processes using JMP DOE.
• Perform effective root cause analysis (5 Whys, DMAIC, 8D) for Wire Bond defects, equipment issues, and yield losses.
• Work closely with cross‑site Package Development teams to understand package design rules and Wire Bond requirements (pad layout, bondability, material compatibility).
• Ensure smooth transition from Development to NPI/Qualification, focusing on Wire Bond process readiness.
• Collaborate with manufacturing, equipment, and process development teams to optimize Wire Bond parameters, bonding programs, and equipment capability.
• Prepare and maintain SOP, WI, FMEA, OCAP, and Control Plan related to Wire Bond processes.
• Ensure effective handover of Wire Bond processes to production for new device/product introduction.
• Handle new material/component first article inspection (e.g., wire type, capillary, leadframe, substrate bondability).
• Drive continuous improvement in Wire Bond cost, UPH, yield, and material efficiency.
• Maintain strong process control to meet Wire Bond yield, throughput, and quality targets.
• Report Wire Bond non‑conformance/customer complaints and follow through on corrective actions.

REQUIRED:

• Min Bachelor or higher Engineering degree (Material/Mechanical/ Mechatronics/E&E, Physics & etc).
• Possessed at least 2-4 years of working experience in wire bond development process.

PREFERRED:

• Hands on personality – production line focus personnel.
• Good project planning, strong sense of quality and urgency.
• Team player with good communication and interpersonal skills.

SKILLS

• JMP/MiniTab /8D /Six Sigma/ SPC.

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