Samtec, Inc is hiring a

PROCESS METROLOGY ENGINEER

Colorado Springs, United States
Full-Time

Founded in 1976, Samtec is a leading global manufacturer of electronic interconnect solutions, generating $950 million in annual revenue. Our extensive product portfolio includes High-Speed Board-to-Board, High-Speed Cables, Optics for Mid-Board and Panel, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers drive innovation to optimize system performance and cost across all interconnect points, supported by a presence in 40+ international locations and products distributed in over 125 countries, ensuring exceptional customer service worldwide.

Samtec is seeking a Process Metrology Engineer in our Colorado Springs, CO location. This is a day shift position with some opportunity to work a hybrid in office / WFH schedule. 
The salary range for this position is $80,000 - $100,000 per year inclusive of applicable bonus and commensurate with experience. Standard benefit offerings available are medical (HSA/PPO), dental, vision, group life, AD&D, short and long term disability, EAP, 401k plus other voluntary options as well as time off.  

Summary/Objective:  The Samtec Optics division is constantly developing new products in the optoelectronic industry and the Microelectronics Process Engineering team is critical to bring those products physically to market. Metrology is an important component to ensure smooth completion of the various products through the entire opto-electronics assembly processes. The process metrology engineer will work with internal design teams as well as with operations to develop and sustain the metrology suite for all optical transceiver products. 
 
Essential Functions/Responsibilities:
  1. Become a technical expert for processes and equipment related to process metrology in order to be key contributor during design reviews and prototype/development phases of new products.
  2. Responsible for programming, creating and documenting a process with procedures for automated and non-automated equipment sets.
  3. Assess existing processes and identify areas of improvement for these systems.
  4. Responsible for material tracking and data compilation of assembly processes for alpha and beta product builds.
  5. Participates and drives FMEA and PFMEAs where applicable.
  6. Generate detailed reports and specifications documenting all experimental and process findings and procedures. Provide DOE, SPC, and yield reporting in a clear and presentable format.
  7. Must be able to work independently and interact with colleagues, customers and vendors as necessary to achieve program objectives.
  8. Evaluate and provide recommendations on new equipment to support continuous technology improvements to meet future customer requirements.
  9. Conduct root cause analysis and corrective actions related to process failures.
  10. Identify and implement cost, quality, and yield improvements.
  11. Supervisory responsibility for technicians may be required. 
  12. Work in a manufacturing environment working directly on product or assisting and observing other engineers, technicians and operators building products.
The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities 
Required Experience: 
  1. Working experience with process metrology equipment such as microscopes and machine vision, mechanical shear- or pull-strength testing, leak testing, cleanliness testing.
  2. Understanding of packaging technology used for the Microelectronic & Semiconductor industries.
  3. Knowledge of materials used for standard package technology, PCBA, Optoelectronics, and assorted substrates.
  4. Demonstrated experience in “assembly process development” is required.
  5. Hands-on experience of the equipment and materials that are used in the industry.
  6. Hands-on experience operating equipment to perform a specific process.
  7. Demonstrated experience is problem-solving and root cause analysis.
  8. MS Office Excel, Powerpoint, Word and Sharepoint proficiency is required
  9. Experience in DOE and data analysis software, like JMP, is preferred.
  10. Experience in microelectronic / microsystem package design and SolidWorks, AutoCAD, or other engineering design, modeling or simulation software is desirable.
  11. Excellent written and verbal communication skills with ability to frame the topic for easy understanding, propose constructive ideas, and communicate can do attitude.
  12. Excellent interpersonal skills in relating to positively engage with both internal and external customers.
  13. Personal flexibility is necessary to ensure efficient execution of the plan and teamwork.
Education:  
  1. Bachelor’s Degree in Engineering, materials, physical sciences or similar field is required. 
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