Physical Design and Integration Engineer

AI overview

Own and lead physical design integration projects at both sub-system and full chip levels, focusing on design partitioning, pin arrangement, and collaboration with CAD teams.
Positions are open for full-time in the ares of physical design and integration from sub-system level to full chip level, involving all aspects of physical design partition and integration functions. Responsibilities
  • Own sub-system level or full chip level physical design integration, particularly focusing on design partition/integration, pin arrangement, feedthrough creation, clock/power grid planning.
  • Be responsible for design integration and signoff coordination at sub-system or full chip level
  • Evaluate/implementation physical design for channel, particularly for route ability and repeater planning
  • Work with block or sub-system owners across the whole design cycles to drive design closure and design release/integration
  • Participate flow/methodology development with CAD team
  • Requirements
  • Experience in design partitioning, budgeting, pin planning with multiple takeout experience
  • Knowledge using synthesis, place & route, analysis and verification CAD tools.
  • Familiarity with logic & physical design principles to drive low-power & higher-performance designs.
  • Knowledge of scripting in some of these languages: Unix, Perl, Python, and TCL
  • Good understanding of device physics and experience in deep sub-micron technologiesKnowledge of Verilog and SystemVerilog
  • Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated.
  • Ability to work well in a team and be productive under aggressive schedules.
  • Education and Experience
    PhD, Master’s Degree or Bachelor’s Degree in technical subject area with more than five years of experience in relevant areas.

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