We are looking for an experienced full-time PCB designer who can help us do PCB design planning and feasibility study, PCB/package co-design, component placement and routing, PCB design and methodology development.
Responsibilities:
PCB technology and material selection
Stackup definition, power planning, high-speed signal route study with SIPI engineers
Footprint and library build up
Critical component ballmap optimization with package designers
Feasibility study
Component placement
Power constraints
HSIO constraint manager file generation
Impedance calculation
DFM/DFA
PCB design methodology development
PCB vendor interaction
Requirements:
Knowledge and experience of high power, high speed, high layer count PCB design
Advanced PCB material and technology knowledge
Expert with Cadence Allegro PCB and APD tool chain
Willing to and proactively engage with system EE, SIPI, thermal/mechanical engineer, and package designers on early design exploration and solution path finding
Basic SIPI knowledge
Basic thermal/mechanical knowledge
CPU/SOC/Microcontroller overall knowledge
Excellent communication skills
Great team player
Highly motivated and self driven
Education and Experience:
Bachelor’s degree or technical training in PCB design
CPU server, networking board design experience preferred
Minimum 7 years related experience
