ESSENTIAL DUTIES AND RESPONSIBILITIES:
- To lead Die Attach Process Module Engineering team for Process/Materials Development, Qualification and Transfer to HVM.
- Responsible for Key technology development & tech-staging to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
- To lead or co-lead Development JET (Joint Engineering Team) with global cross-functional teams incl. process, materials, CPI, package design, thermal-mechanical simulation, quality and other related stakeholders.
- To build and nurture strong process development team related to high density ultra-thin die attach process, material and packaging architecture - emphasizing deep engineering fundamental, structured methodology and DOE planning / execution / analysis.
- To lead studies related to in-depth fundamental investigation/characterization in packaging development.
- Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards.
- To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products.
- To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities.
- To drive breakthrough in product packaging materials and process.
- To support IR5.0 Digital Transformation for Packaging process e.g. Process Digital Twins, Advanced Process Control (APC), Fault Detection Control (FDC), fundamental lab characterization and design rules definition.
- Drive yield analysis activities in process characterization and qualification phases.
- To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.
REQUIRED:
- Master Degree or PhD in Materials Engineering / Mechanical Engineering / Physics / Micro-electronics.
- Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology.
- Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology solutions.
- Minimum 10 years of Semiconductor Packaging Process with in-depth knowledge on IC packaging processes, high-density / ultra-thin die stacking technology development hands-on & indepth exposure.
- Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies.
PREFERRED:
- Experience in application of AI / ML-augmented engineering development and innovation and analytics.
- Proven experience with in-depth engagement in materials and process technology fundamentals, with materials characterization lab either internally, suppliers or other 3rd party.
- Personal hands-on experience on advanced lab instruments e.g. SEM/FIB, EDX/FTIR, Shadow Moire, will be added advantage.
SKILLS:
- Ability to lead complex technical investigation and analysis with global cross-functional teams.
- Ability to work with internal development / HVM teams and suppliers on process qualification and co-development.
- Ability to lead complex technical investigation and analysis with global cross-functional teams.
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