Lead Mechanical Engineer (Data Center Infrastructure)

What you'll do

Giga's mission is to manufacture data centers to support the AI ramp. We're moving beyond traditional construction to a product-based approach, designing and mass-producing high-performance infrastructure that can keep pace with the exponential demand for compute. As Lead Mechanical Engineer, you'll own the mechanical design of these next-generation facilities.

This is a rare opportunity to define the mechanical DNA of a rapidly scaling infrastructure company. You won't just be managing a single build—you'll be creating the Plan of Record (POR) for Giga Data Centers, a standardized, manufactured product that will be deployed globally.

You'll set the standard for high-density AI cooling, designing liquid cooling loops, thermal management systems, and mechanical infrastructure that can handle the most demanding compute workloads on the planet. The AI ramp is the defining industrial challenge of our time, and you'll build the engine that powers it. Your designs will be manufactured and deployed rapidly, with direct impact visible across hundreds of facilities.

Where you'll work

If based outside of our Houston, Long Beach, Reno, or San Francisco hubs, this role will be based remotely from your home office. You must be willing to travel as needed to our job sites and to one of our hub offices.

Responsibilities 

• Develop and maintain the mechanical POR for Giga Data Centers, defining the "Gold Standard" design that enables manufacturing of reliability and efficiency at scale
• Author and own the internal engineering library including technical specifications and Basis of Design documents, deciding what we build and how we measure it
• Design to global and local standards, leveraging ASHRAE TC 9.9 to define environmental envelopes for AI hardware and ensuring compliance with ASHRAE 90.1 for energy efficiency
• Guide external engineering firms to localize designs while maintaining strict adherence to core performance intent and standardization requirements
• Validate airflow patterns and rack-level thermal performance using computational fluid dynamics, ensuring compliance with ASHRAE thermal guidelines for Class A1-A4 environments
• Execute rigorous hydraulic analysis and thermal load flow studies, conducting pipe stress analysis per ASME B31 standards to ensure system integrity under thermal expansion and seismic events
• Engineer complex cooling loops (Direct-to-Chip, Immersion, RDHx) aligned with OCP (Open Compute Project) specifications for liquid cooling interoperability
• Select and specify pumps, fans, chillers, dry coolers, and control valves for high-density compute environments
• Create detailed Bills of Material (BOMs), Quantity Take Offs (QTOs), and Commissioning scripts to support a manufacturing-first supply chain
• Develop Sequence of Operations (SOO) and Control Narratives that dictate how mechanical systems respond to dynamic AI load changes
• Use advanced simulation tools to optimize thermal performance and validate designs before manufacturing

Requirements

• Professional Engineer (PE) license required
• Bachelor's or Master's degree in Mechanical Engineering
• 7+ years of mechanical engineering experience with strong focus on mission-critical or industrial facilities
• Deep working knowledge of ASHRAE TC 9.9 (Thermal Guidelines for Data Processing Environments)
• Familiarity with ASME B31.3/B31.9 (Process Piping) for liquid cooling loops
• Strong background in CFD analysis using tools like 6Sigma or Ansys
• Experience with pipe stress analysis software (Caesar II or AutoPIPE)
• Proficiency in Revit/AutoCAD for mechanical design
• Experience with hydraulic modeling software (AFT Fathom or Pipe-Flo)
• Proven ability to create engineering standards from scratch rather than just following existing ones
• Strong understanding of high-density cooling solutions and thermal management
• Experience specifying HVAC equipment including chillers, pumps, and cooling towers
• Track record developing standardized designs for scalable deployment

Bonus points

• Understanding of OCP (Open Compute Project) cooling initiatives and specifications
• Experience with liquid cooling technologies (Direct-to-Chip, Immersion, RDHx)
• Background in data center or high-density compute facility mechanical design
• Knowledge of ASHRAE 90.1 energy efficiency requirements
• Experience with manufacturing-first design approach (DfMA principles)
• Startup or high-growth company experience
• Track record creating Plans of Record for manufactured products
• Experience managing A&E firms and maintaining design standards across partners
• Familiarity with commissioning processes and functional testing for mechanical systems
• Understanding of AI infrastructure thermal requirements and challenges
• Experience with design-build or fast-track project delivery

Benefits

• Subsidized health, dental, and vision insurance
• Significant equity in a profitable, IPO-bound company
• 401(k) with 4% employer match
• Unlimited PTO
• Parental leave FSA/HSA options
• Commuter benefits
• Monthly team onsites across all offices