Board Thermal Simulation Engineer

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place! E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems. We’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life. Own the end-to-end design, development, and manufacturing transition of spacecraft harnesses, cables, connectors, and interconnect solutions for a LEO satellite constellation. You will drive connector selection from custom and COTS sources, develop cable assemblies spanning STP to coax to fiber, and work directly with international vendors to move designs from prototype through volume production.  Key Responsibilities:

• Perform component-level thermal analysis including junction temperature calculation, hot-spot identification, and heat-path evaluation.
• Develop thermal models using analytical methods and simulation tools for steady-state and transient conditions.
• Evaluate and recommend cooling strategies (conduction, convection, radiation, heat spreading) for avionics boards.
• Assess temperature effects on component aging, reliability, and derating requirements.
• Analyze thermomechanical degradation risks including CTE mismatch, solder fatigue, and connector stress.
• Perform system-level thermal budgeting and define thermal interface requirements across subsystems.
• Evaluate environmental thermal loads from orbit-induced temperature swings and operational heat dissipation.
• Select materials based on thermal conductivity, expansion properties, and long-term reliability.
• Validate thermal models with empirical measurements and test data from EM and QM builds.
• Collaborate with electrical, mechanical, and reliability engineers for integrated thermal solutions.
• Document thermal requirements, design guidelines, and analysis results.

Required Qualifications:

Bachelor’s or Master’s degree in Mechanical Engineering, Aerospace Engineering, or related field.

3+ years of experience in thermal analysis for electronics, preferably in aerospace or space applications.

Proficiency with thermal simulation tools (Ansys IcePak, FloTHERM, or equivalent).

Strong understanding of heat transfer fundamentals (conduction, convection, radiation).

Experience with component derating for thermal environments.

Ability to create and validate thermal models against test data.

Preferred Qualifications:

• Experience with satellite or spacecraft thermal analysis and orbital thermal environments.
• Background in thermal cycling test planning and correlation of simulation to test results.
• Familiarity with Ansys IcePak specifically.
• Experience with system-level thermal budgets and interface management.
• Knowledge of PCB material properties and their thermal behavior.
• Understanding of reliability implications of thermal stress on electronics.

Tools & Technologies:

• Ansys IcePak (or equivalent thermal simulation tool)
• MATLAB or Python for analytical modeling
• CAD tools for geometry import and model setup