- Focused, self-motivated semiconductor foundry interface engineer providing strategic and technical leadership across the semiconductor industry involving wafer foundries and fabless design house.
- Drive STCO/DTCO power-performance-area-cost (PPAC) modeling and simulation to help qualify the best foundry Technology.
- Good understanding of advanced CMOS device architecture (FinFET and GAA) and process-design Kits (PDK)
- Define Reliability specifications to meet the product needs by understanding the customer needs and through closely collaborating with internal product/process development teams.
- A multi-functional teammate with hands on skills for SPICE and layout tools. Understanding the advanced packaging Technology
- Specialized in yield and reliability analysis, process flow and integration development, product design and testing optimization to accelerate advanced CMOS technology qualification and mass production ramp-up.
- Collaborating with integration, module & 3D packaging team (internal and external) to form a clear understanding of the process flow to understand any technology gaps and produce innovative ideas to close the gaps and meet the future needs.
- Build relationships with suppliers, key stakeholders, senior executives, and multi-functional teams to drive multiple product ramp-up and performance boost projects in fast-paced work environment to meet ambitious timeline.
- Proven in-depth technical problem-solving and decision-making skills with broad knowledge in electrical / physical (eFA/pFA) and statistical failure analysis to identify root cause, develop and implement corrective and preventive actions in a timely manner.
- Proficient in statistical computation and modeling skills and sound programming capabilities in Python, JMP and in-house systems.
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Education: University degree (Master/PhD) in electrical engineering or a comparable subject
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Personality and working practice: communicative, problem-solving mindset, responsible, initiative, flexible and target oriented. Comfortable in working in a fast paced, dynamic environment with changing priorities.
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Experience and Knowledge: Minimum 10+ years of experience working with foundry partner, solid understanding of PDK collaterals and deployment in design environments, handling of process and yield related challenges and worked with foundry to negotiate the optimum process and manufacturing cost.Worked with multiple Foundry Vendors TSMC/UMC/Samsung.
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Qualifications: ability to identify and analyse tasks efficiently within the scope of your work and to develop pragmatic application-specific solutions; pronounced ability to communicate, relevant experience in the methodology of problem solving as well as in the cooperation and leadership of international and cross-functional teams
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Technical Skills: SVRF/TVF based customization, Perl/Python for automation
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Languages: fluent in English and German written and spoken
Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
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