Solidigm is seeking an innovative Package SubCon Integration Engineer to support pathfinding and development of package technologies for Solid State Drive (SSD) and NAND flash storage card applications. In this position, you will be responsible for innovation in packaging technologies to meet SSD product roadmap. In addition, you will be responsible for interfacing with internal/external standards forums. Other responsibilities include driving/tracking package design milestones, integrating product requirements into packaging solutions, identifying and resolving packaging design issues, and communication of design status.
- Help to support logistics at OSAT Assembly and TEST.
- Drive integration work with internal stakeholders and OSATs.
- Manage New Product Introduction (NPI) builds in alignment with OSATs and suppliers.
- Data analysis and drive recommendations to improve quality and reliability.
- Recommend Substrate stack-ups, Build Of Material (BOM) selection.
- Solder Joint Reliability (SJR) board builds.
- BS Mechanical, Electrical or other Engineering discipline
- 7-10 years of experience in semiconductor package development
- Experience in using AutoCAD and Cadence suite (APD, Editor, SIP)
- Schematic entry and simulation are an advantage
- Able to engage in root cause analysis, design of experiments, and data analysis
- Excellent communication skills to work effectively across different geographies
Preferred Qualifications
- Solid understanding of package substrate design practices from a signal integrity perspective.
- Working knowledge of HSPICE, Ansoft Q2D/Q3D and/or any other field solver tools.
- Working knowledge of high-speed design signal integrity and power delivery practices; experience with high-speed DDR package design is a highly desirable.
- Knowledge of electrical analysis and design of high-speed buses (differential and single ended) as well as familiarity with simulation, modeling, and analysis tools.
- Knowledge of Printed Circuit Board (PCB) assembly processes and package to board interconnects
- Knowledge of flip chip packaging
- Good understanding of transmission-line effects, crosstalk, frequency domain analysis, termination techniques, signal return paths, design of experiment and statistical analysis.
- Demonstrated skills in program management, communication, teamwork, planning, and prioritization.
