Staff Engineer, Technology Development Quality & Reliability Engineering

• The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. 
• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements.  
• Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability.  
• Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions.  
• Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies.  
• Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.  

• This position requires a candidate with MS / PhD degree in Mechanical/Materials Engineering.  
• Knowledge of semiconductor packaging highly desired.
• Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required.
• Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required.  

Desired Skills: 

• Preferred candidate will have worked on projects related to semiconductor packaging from both mechanical and electrical integrity perspective.

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