ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements.
- Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
- Develops new package and SMT process qualification programs.
- Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
- Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
- Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
- Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up.
- Acts as a liaison with suppliers/vendors.
- Maintains product quality while developing and introducing package cost reduction programs.
- Coordinates the introduction of new package processes into production.
- Using appropriate tools, performs integrity analysis of packages.
PME Specific Role Description includes the following but not limited to:
- SMT material and process development
- SMT AI/ML integration development
- SMT technology (material/process/metrology/equipment) pathfinding & roadmap
- Stencil design/development for new components
- DFM assessment and NUDD risk management
- Process-Material-Component-board-drive interactions
- DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge
- Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.
- Statistical Tools: Statistical analysis (JMP/Minitab), Green Belt/Black Belt certification
- Special engineering characterization & improvement projects
- Factory emergency taskforce support
PTDI team embodies a high performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive “complete ownership” characteristic and have strong engineering pride, always willing to go above and beyond.
REQUIRED:
- Bachelor/Master/PhD engineering/material/science required plus min 8 years of relevant work experience, min 5 year for PhD. Relevant work experience must be in engineering role within semiconductor industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.
PREFERRED:
- Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory.
- Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
- Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques)
- Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel
- Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution
- Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition
- Proven success leading technical team(s) in previous work experience
SKILLS:
- Track record of AI/ML experience is added advantage.
- Strong verbal and written communications skills
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