- Collaborate with cross-teams to perform early risk assessment and design optimization for SIP packaging products, ensuring the most feasible design with best DFX for final product use.
- Define package design NUDDs and work with process/product develop team to initiate necessary new technology programs development for future product applications.
- Lead deep-dive discussions on design, process and product-related procedures to address critical product requirements and drive solutions to accelerate new product TTM.
- Partner with the team to mitigate design risks through simulation and feasibility studies.
- Work with IT teams on system development, including defining the Statement of Work (SOW), development, conducting User Acceptance Testing (UAT), and providing training.
- MS or PhD in Mechanical or Materials Engineering.
- Strong knowledge of semiconductor package design is highly desired.
- Excellent coordination skills with the ability to work effectively with cross-function team.
- Proficient in English with strong presentation and communication skills.
- Demonstrated ability to multitask, meet tight deadlines, and working under pressure.
Desired Skills:
- Candidates with semiconductor packaging process and design background/experience will be mostly preferred.
Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity. Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.
