Staff Engineer, Failure Analysis Engineering

Perform package and PCBA  assembly test defect from production, qualification on semi-finished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for root-causing of defect/s. SME on key FA equipment, maintain the FA tracking and FA equipment log sheet. Develop the FA process and FA capability for new product and new technologies.

• Bachelor Degree and/or Master in Electrical/ Electronic or Microelectronic Engineering with minimum 5 years in failure analysis
• Familiar with package and device analysis methodology
• Familiar with semiconductor and SMT assembly process and technology
• Familiar with memory product technology and structure
• Understand memory product test process and methodology
• Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis, cross-section and dye and Pull analysis
• Strong solder joint defect assessment skills.
• Good communication and presentation skills
• Good teamwork spirit
• Fluent in English speaking, reading and technical FA report writing
• Previous FA experience in SMT assembly environment is preferred

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