Staff Engineer, Failure Analysis Engineering

• Perform Integrated circuit package and PCBA  assembly test defect from production, qualification on semi-finished or finished products.
• Define FA flow for each FA case. Generate FA report and assist cross-functional team for root-causing of defect/s.
• SME on key FA equipment, maintain the FA tracking, dashboard.
• Develop new FA process and FA capability for new product and new technologies. 

• Bachelor Degree and/or Master in Electrical/ Electronic or Microelectronic Engineering with minimum 5 years in failure analysis.
• Familiar with package and device analysis methodology.
• Familiar with semiconductor and SMT assembly process and technology.
• Familiar with memory product technology and structure.
• Understand memory product test process and methodology.
• Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis, cross-section and dye and Pull analysis.
• Strong solder joint defect assessment skills.
• Good communication and presentation skills.
• Good teamwork spirit.
• Fluent in English speaking, reading and technical FA report writing.
• Previous FA experience in SMT assembly environment is preferred.

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