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Key Technical Integration role to drive and enable product, silicon, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
- To lead the 2.5D/3D advanced packaging conceptual to productization activities with global cross-functional teams including silicon design, product design, fab back-end, process engineering and test engineering in delivering Best-In-Class and Industry leading products
- To establish innovation strategies to achieve breakthrough in product packaging design, performance, quality and cost
- To engage in collaboration with suppliers, service providers, academia, industry consortium in establishing new industry standards
- To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology
- To coordinate industry benchmarking, competitive analysis.
- Minimum 10 years of Semiconductor Packaging Process with in-depth exposure to wafer RDL process, wafer bumping process, and/or TSV wafer processing technology in wafer fab backend, or high-density 2.5D / 3D advanced packaging architecture will be desired.
- Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology solutions.
- Strong engagement in Fab Backend or Packaging technology development experience and well-versed with R&D methodology.
- Proven experience with in-depth engagement in silicon design rule, materials and process technology fundamentals.
- Ability to lead complex technical investigation and analysis with global cross-functional teams. Ability to drive external CM / OSATs / suppliers on process qualification and co-development. Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies.
- Experience in application of AI / ML-augmented engineering development and innovation and analytics.
- Strong degree in Mechanical / Materials Engineering (Bachelor/ Masters Degree). PhD research experience will be an added advantage.
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