Senior Manager, Packaging Engineering

Senior Manager in this role will be responsible for researching, developing, and implementing innovative packaging solutions and requires a deep understanding of solid-state device physics, materials science, and packaging technologies, and expected to manage all aspects of packaging technologies required for Materials Center of Excellence (MCoE). Responsibilities encompass a wide range of tasks, from strategic planning to day-to-day operations, and require a combination of technical expertise, leadership skills, and problem-solving abilities. Candidate shall be specialized in advanced 3D & heterogenous packaging solutions, plays a critical role in ensuring successful and efficient implementation of next gen flash products.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Strategic Planning: Develops and implements long-term strategies on introducing advanced materials for solid-state device packaging to align with overall business objectives and market trends.
• Team Leadership: Manages and motivates a team of packaging engineers, technicians, and support staff.
• Material & Process Optimization: Identifies and implements advanced materials to be used in packaging processes to enhance efficiency, reduce costs, and improve performance and reliability of solid-state devices.
• Technology Evaluation: Assesses new packaging technologies and materials specifically designed for solid-state devices, such as advanced thermal management solutions and new gen 3D packaging techniques.
• Supplier Management: Oversees relationships with suppliers of packaging materials, equipment, and testing services tailored for SiP & Solid-state devices.
• Budget Management: Develops and manages budgets for Materials CoE Lab & path finding projects for next gen drives.
• Quality Control: Ensures that packaging operations adhere to strict quality standards and regulations specific to materials used in flash devices.
• Regulatory Compliance: Ensures compliance with relevant industry regulations and standards related to solid-state device packaging.
• New Product Introduction (NPI): Coordinates the introduction of new materials in packaging technologies and processes for SSD.

REQUIRED:

Candidate shall possess at least 15+ years of experience with a Master’s or PhD in materials science, electrical or mechanical engineering and preferably specialized in solid-state physics, semiconductor devices, and packaging technologies.

SKILLS:

• Leadership Skills: Ability to lead and motivate teams, build consensus, and make effective decisions.
• Problem-Solving Skills: Ability to identify and solve complex problems related to packaging solid-state devices.
• Project Management Skills: The ability to manage multiple projects simultaneously and deliver results on time and within budget.

• Communication Skills: The ability to communicate effectively with both technical and non-technical stakeholders.
• Office: Spending time in an office environment, planning, analyzing data, and communicating with colleagues.
• Manufacturing Floor: Visiting the manufacturing floor to inspect equipment, monitor processes, and troubleshoot problems related to solid-state device packaging.
• Supplier Facilities: Traveling to supplier facilities to evaluate new material technologies, processes and equipment specifically designed for packaging.

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