1. Manages production support engineering for a specific product or group of products after transfer from design to high volume production.
2. Responsible for wafer level / package level test program enhancement & change buy-off.
3. Responsible for Failure Analysis & test program debug to provide solution for product yield improvement to meet yield and quality target, and special material disposition.
4. Sustains products to be competitive with cost reduction, throughput enhancement, quality improvement and yield improvements, through process/test program fine tune, failure analysis, data analysis, and with leveraging experiment or volume data of production.
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