- Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly.
- New DP process recipe development to achieve high quality product and cost down.
- New DP technology evaluation and introduction.
- Co-work with material team with new package related material evaluation.
- Co-work with objective owner to handle new product DP process.
REQUIRED:
- Bachelor or above, major in Automation, Mechatronics, Materials Science and Technology, etc.
- 1-3 years’ process experience in Assembly.
- Good communication skill and team work spirit, willing to work under certain pressure.
PREFERRED:
- Strong Knowledge at assembly process.
- Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other similar statistic software, Spot-fire) etc.
- Familiar with one of programming language will be a plus.
SKILLS:
- Good communication skill at both Chinese and English.
Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity. Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.
