General Description:
The Mixed Signal Solutions department at HRL Laboratories is a highly talented team of scientists and engineers with diverse backgrounds in integrated circuit design, advanced packaging and integration, novel signal processing and algorithm development, and integration / characterization of highly complex digital and mixed signal systems and subsystems for commercial and government applications in an innovative research and development environment.
We seek an experienced candidate capable of serving technical and programmatic leadership roles in several R&D efforts focused on development, demonstration, and maturation of high dynamic range, low noise, densely integrated mixed signal systems and subsystems. A team effort is required to accommodate the multi-faceted design, analysis, integration, and demonstration of these systems; for this specific role, we seek a candidate with deep expertise in high speed (up to 10 GHz) RF and digital signal analysis, including both component level analyses (e.g. electromagnetic simulations of advanced packaging components, SPICE-level simulations of precision analog circuit elements), and integrated system-level electrical analysis (e.g. active and passive power delivery system analysis, inter-symbol interference and other signal integrity analysis, crosstalk and random noise analysis, etc.) of dense, complex integrated systems involving hundreds of high speed signals.
Essential Duties:
This role will require attention to tradeoffs involving all facets of system development (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability / cost constraints, etc.) and involving theory-driven analyses of candidate approaches.
Must organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above).
Must provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.).
Must develop and maintain relationships with relevant vendors and partner organizations, as well as with other internal leads and teams working on other system elements.
Must have excellent communications skills, organizing and presenting results in written reports and oral presentations, both to internal and external stakeholders and customers.
Must create and manage work plans to meet or exceed schedule deadlines and technical expectations.
Must lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.
Required Skills:
More than 10 years of experience in design and integration of high-performance mixed signal systems, with a particular emphasis on design, analysis, characterization, integration, and test of RF or high-speed digital systems.
More than 10 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new interconnect / integration technologies.
Demonstrated experience developing external partnerships and vendor relationships.
More than 5 years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding.
Familiarity with advanced commercial packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) and integrated circuit processing and integration techniques.
Familiarity with typical mixed signal systems and components (transmitters, receivers, ADCs, DACs, amplifiers, mixers, RF and microwave components, etc.) and associated tradeoffs in one or more application spaces (RADAR, comms, EW, imaging, etc.)
Basic background knowledge across all domains relevant to mixed signal systems (e.g. thermal-mechanical design, integrated circuit design, semiconductor processing and associated material science, control system theory, etc.) with deeper background knowledge in areas specifically relevant to interconnect / integration within such systems (e.g. electromagnetic modeling, multi-conductor transmission line theory, signal integrity, power delivery system analysis, SPICE-level circuit modeling).
Familiarity with metrics and methods used to characterize high speed electrical interconnects (VNA, TDR, O-Scope) and low noise electronics.
Familiarity with standard system engineering practices and terminology.
Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
Ability to work well in a team and independently.
Required Education:
MS or Ph.D. in Electrical Engineering, Physics, Material Science, or related scientific discipline.
Physical Requirements:
Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
Special Requirements:
U.S. citizenship
Must be able to obtain and maintain a security clearance.
Active SSBI strongly preferred.
Compensation:
The base salary range for this full-time position is $163,150 - $209,088 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.
