General Description:
This employment opportunity requires working 70-90% of each day in a class 10 cleanroom. The individual will be responsible for overseeing the processing of wafer lots through various process modules and conducting hands-on semiconductor fabrication and cleaning processes with minimum supervision. The candidate will be required to operate a state-of-the-art precision die bonder, after successfully passing a rigorous training period, and will be expected to develop a deep understanding of fine-alignment processes in order to create state-of-the-art
2.5D/3D integrated electronic technologies.
Essential Duties:
Create fabrication process flows with detailed instruction to sustain and develop new technologies with high yield
Safely handle 75 mm and 100 mm diameter wafers and small <1cm chips using tweezers and vacuum wands
Wafer- and die-level inspection using a variety of metrology tools such as optical microscope, SEM and profilometer
Operate precision semiconductor bonding tools with sophisticated software control interface
Collect and organize inspection and bonding data, perform data analysis, and prepare presentation packages for team members
Daily communication with research and program management staff
Required Skills:
Hands-on semiconductor processing experience of silicon and/or III-V wafers for integrated circuit or detector fabrication; working knowledge of photolithography, deposition, etch and flip-chip bonding
Experienced in performing process setup and operation of automated semiconductor equipment
CAD and mask layout skills, knowledge of electronic circuits, semiconductor processing skills
Hands-on experience operating a precision die bonder
Interest in reading and understanding scientific/engineering literature related to job duties.
Required Education:
Education: BS (minimum) or MS degree in an engineering field (electrical, mechanical, chemical or material science)
Experience: 2-5 years of fabrication cleanroom experience
Special Requirements:
US citizenship only, and be willing to obtain security clearance (secret or top secret)
Compensation:
The base salary range for this full-time position is $99,705 - $124,683 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.
