Process Engineer

Founded in 1976, Samtec is a privately held, $1 Billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.

Samtec is seeking a Process Engineer for the Colorado Springs, CO location. The salary range for this position is $100,000 - $130,000 per year inclusive of applicable bonus and commensurate with experience. Standard benefit offerings available are medical (HSA/PPO), dental, vision, group life, AD&D, short and long term disability, EAP, 401k plus other voluntary options as well as time off. 

1. Responsible for products and processes transferred from development to production
2. Plans and manages continuous improvement activities for assigned products, processes and equipment
3. Technical expert for processes and equipment
4. Ensures that documentation and methods are in place to support operations
5. Reviews output data from process and implements changes to meet desired yield targets and statistical process metrics
6. Create DOE’s and experiments to optimize parameters and improve process yields and product reliability
7. Guides and manages tooling and spare parts for processes and equipment
8. Participates and drives FMEA and PFMEAs where applicable
9. Must be able to work independently and interact with colleagues, customers and vendors as necessary to achieve program objectives
10. Work in a cleanroom manufacturing environment, assisting and observing operators and technicians maintaining processes and equipment
11. Performs and improves preventative maintenance procedures for equipment

1. 7+ years of semiconductor, optoelectronics or microelectronics packaging process and equipment engineering experience.  Die bonding experience is strongly preferred
2. Materials used for standard package technology, PCBA, Optoelectronics, and assorted substrates.
3. Demonstrated experience in assembly process development and improvement
4. Hands-on experience of the equipment and materials that are used in the industry.
5. Hands-on experience operating equipment to perform a specific process.
6. Demonstrated experience in problem-solving and root cause analysis.
7. MS Office Excel, Powerpoint, Word and Sharepoint proficiency is required
8. Experience in DOE and data analysis software, like JMP, is preferred.
9. Experience in microelectronic / microsystem package design and SolidWorks, AutoCAD, or other engineering design, modeling or simulation software is desirable.
10. Excellent written and verbal communication skills with ability to frame the topic for easy understanding, propose constructive ideas, and communicate can do attitude.
11. Must be a self-starter with strong leadership skills.
12. Excellent interpersonal skills in relating to positively engage with both internal and external customers.
13. Personal flexibility is necessary to ensure efficient execution of the plan and teamwork.

1. Bachelor’s Degree in Engineering (Mechanical, Electrical, Chemical, Material Science) or equivalent is required.