•Defines, develops and qualifies new wafer level packages with subcontractors and maintains quality of existing packages. ·
•Manages next generation packaging technologies with internal R&D teams and eternal technology partners
•Works closely with the various business units within the company to understand future product needs and suggest packaging solutions.
•Drive yield improvement and better efficiency of subcontractors operation
•Manages the entire life cycle of packages from path finding all the way to qualification and HVM
•This position requires a candidate with Bachelor/ Master degree in Mechanical / Materials Engineering or equivalent with several years of relevant work and packaging program management experience
•Hands-on experience in various aspects of packaging such as design, material, process etc required.
•Experience working closely with wafer fabrication facilities, testing houses and substrate suppliers highly desirable
•Knowledge of electrical aspects of packaging, EFA/ PFA flow, signal and power integrity (SI / PI) analysis background is plus.
•Knowledge of wafer level package as bumping, RDL, 3D packaging
•Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required.
•Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required
Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity. Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.
