NAND Package Quality & Reliability Engineer

Our Validation, Quality and Reliability team is responsible for product reliability through all phases of product life cycle, from technology development and pathfinding, product design validation, manufacturing, leading to the high volume manufacturing (HVM) of Solidigm's 3D NAND memory packages and Solid-State Drives (SSDs).

As a NAND package quality and reliability engineer, you'll be responsible for developing and qualifying innovative semiconductor package technologies for Solidigm’s latest products. Package reliability engineers take responsibility for setting and executing reliability requirements to meet product needs. They influence the design, material selection and process development of the new package technology to meet those needs, using a wide variety of skills, from analytical models, advanced experimental designs and extensive data analysis, to evaluate and improve the package technology.  They will be instrumental to the analysis of reliability failures to find the root cause of failure mechanisms and drive corrective actions.  We measure our success by delivering best in class quality on our latest product technologies.
 

Responsibilities

• Define reliability requirements for next generation package technologies based on product use conditions.
• Influence new package design, process and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and silicon-package interactions.
• Perform package design/assembly risk assessments and develop a qualification plan supporting product launch.
• Collection and analysis of all stress test data (HAST, TC, Precon, HTS).
• Design test vehicles to isolate failure mechanisms and the root causes.
• Innovate analytical and experimental methods to validate package technology reliability.
• Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.

• The candidate must possess a Bachelor’s degree in Mechanical Engineering, Material Science or related field.
• 6+ years of experience in semiconductor package development and reliability.
• Hands-on experience of fault isolation and failure analysis, including electrical testing, die segmentation, layout analysis.
• Able to engage in root cause analysis, design of experiments, and data analysis.
• Excellent communication skills to work effectively across different geographies.

Preferred Qualifications:

• Knowledge of Printed Circuit Board (PCB) assembly processes and package to board interconnects.
• Knowledge of package and board design software (Cadence Allegro/Mentor).

For California, Colorado, New York, Washington, and remote roles: The compensation range for this role is $97,230 to $169,020. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.