Western Digital is hiring a

Masters/PhD Internship - Product Design Engineering

Simpang Ampat, Malaysia
Internship
  • Predict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilities  
  • Design and conduct fundamental level experiments for structural and material characterizations
  • Work in data analytical, machine learning, AI 
  • Research, explore and establish simulation capabilities in challenged areas
  • Masters/PhD in Engineering Mechanical / Materials / Manufacturing

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to [email protected].

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