Western Digital is hiring an

Intern 6, Engineering

Shanghai, China
Internship
  • Lead research, surveys, benchmarking, and innovation in advance packaging technologies.
  • Conduct prototyping and feasibility assessments for new technologies and platforms.
  • Integrate emerging technologies and platforms into package design and processes to validate functionality.

 

- Minimum Bachelor’s degree in Semiconductor science / Material / Electronic or equivalent.
- Skillful at English communication, on writing & speaking.
- Good communication skill.
- Knowledge of Semiconductor manufacturing process and automotive standard practices is a plus.

Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity.  Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.

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