pspan style="font-family: 'book antiqua' , palatino;"span style="background-repeat: no-repeat;outline: none;color: rgb(38,50,56);font-size: 14.0px;font-style: normal;font-weight: 400;letter-spacing: normal;text-indent: 0.0px;text-transform: none;word-spacing: 0.0px;"Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service./spanspan style="color: rgb(38,50,56);font-size: 14.0px;font-style: normal;font-weight: 400;letter-spacing: normal;text-indent: 0.0px;text-transform: none;word-spacing: 0.0px;" /span /span /ppspan style="font-family: 'book antiqua' , palatino;"span style="color: rgb(38,50,56);font-size: 14.0px;font-style: normal;font-weight: 400;letter-spacing: normal;text-indent: 0.0px;text-transform: none;word-spacing: 0.0px;"span style="font-size: 11.0pt;"Samtec began investing in Microelectronics in 2010 and has emerged as a technology leader in advanced glass-based packaging. As we expand our investment in this cutting-edge technology, we are looking for energetic and innovative experts to join our growing team of scientists and engineers developing glass interposers and other novel device fabrication technologies for transparent substrates. One critical role is for a world-class wafer development engineering director to join the Glass Core Technology Development Center and Wafer Fab in New Albany, Indiana. The successful candidate will be responsible for developing wafer fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated. They will work with the engineering, manufacturing, sales and marketing teams to ensure that products being developed for our GCT customers (both internal and external to Samtec) meet performance, design, and price requirements, and they can be further fabricated and integrated into the customers’ final products./span/span /span /pp style="text-align: center;"span style="font-family: 'book antiqua' , palatino;" emspan style="text-decoration: underline;"strong**THIS POSITION WILL BE ONSITE IN NEW ALBANY, IN **/strong/span/em/span /pdiv style="margin-bottom: 7.5pt;text-align: justify;line-height: 17.0pt;"div style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Role Overview:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Samtec is seeking a dynamic and visionary Wafer Development Engineering Director to spearhead our Glass Core Technology Development Center and Wafer Fab in New Albany, Indiana. This pivotal role will lead a team of scientists and engineers dedicated to advancing glass interposers and other innovative device fabrication technologies for transparent substrates./span/divdiv style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"/span/b/divdiv style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Why Samtec:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Join Samtec at the forefront of innovation in electronic interconnect solutions. We offer a collaborative and inclusive work environment where your ideas and expertise will drive the development of next-generation technologies. As part of our team, you will have the opportunity to make a significant impact on our global operations and shape the future of electronic packaging solutions./span/divdiv style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"/span/b/divdiv style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Key Responsibilities:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" /span/divulli style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Strategic Leadership:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Drive the vision and strategy for wafer development, aligning with Samtec's commitment to technological advancement and operational excellence./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Technical Expertise:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Oversee the design, development, and optimization of processes for glass interposers and related technologies, ensuring state-of-the-art solutions that meet stringent performance and reliability standards./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Team Management:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Mentor and guide-lead from the side-a multidisciplinary team of engineers and scientists, fostering a culture of innovation, collaboration, and continuous learning./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Collaboration and Partnership:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Work closely with cross-functional teams across Samtec's global network to integrate cutting-edge technologies into our product portfolio and enhance customer value./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Research and Development:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Lead RD initiatives to explore and implement next-generation fabrication techniques, leveraging transparent substrates to redefine possibilities in electronic interconnect solutions./span/li/uldiv style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Qualifications:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" /span/divulli style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Education:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Advanced degree in Electrical Engineering, Materials Science, Physics, or related field. PhD preferred./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Experience:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Extensive experience (10+ years) in semiconductor or microelectronics industry with a focus on wafer development, process engineering, and technology transfer. Experience in glass-based packaging or advanced semiconductor packaging technologies is highly desirable./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Leadership:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Proven track record that includes 5+ years of leading high-performance teams in a technology-driven environment. /span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Innovation Mindset:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Passion for innovation and disruptive technologies, with a deep understanding of materials science and semiconductor manufacturing processes./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Communication Skills:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" Strong interpersonal and communication skills, with the ability to articulate complex technical concepts to diverse stakeholders./span/lili style="line-height: normal;"bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Technical Skills:/span/bspan style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;" /span/liulli style="line-height: normal;"span style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Expertise with Glass, Silicon, Semiconductor, Silicon Photonics, or Hard drive wafer process development and integration, qualification and high-volume manufacturing are strongly desired. /span/lili style="line-height: normal;"span style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Solid Experience with fab equipment including lithography (i-line), PVD, CVD, wet etch, dry etch (RIE), ECD Cu plating, final finish plating, electrical test, and characterization is strongly desired. /span/lili style="line-height: normal;"span style="font-size: 12.0pt;font-family: 'Times New Roman' , serif;"Candidate experience must demonstrate success at developing process flows which integrate process modules (lithography, deposition, etch) to deliver new products for customers ion time/i. /span/li/ul/ul/div
