BOP & EMI Process Development (NPI) Engineer

Process Development owner at BOP Process such as Package saw/ Laser mark/ Solder ball attached- SBA/UBA & EMI etc. 

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Define the process window and recipe baseline by using JMP DOE approach.
• Good in problem solving and work on the Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology.
• Work closely with Cross site’s Package development team to understand the Package Design Rules & Requirements
• Ensure smooth transition from Development to new product qualification phase.
• Work closely with manufacturing process and equipment team, and cross site process development team.
• Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
• Ensure effective handshake/pass over of process for New device/product introduction to the production line and new process technology capabilities development.
• Responsible for new material/component first article inspection and final buyoff.
• Continuous improvement on direct/indirect material/UPH cost down & yield enhancement program.
• Ensure robustness of process control to meet yield & through-put expectation.
• Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.

REQUIRED:

• Min Bachelor or higher Engineering degree (Material/Mechanical/ Mechatronics, Physics & etc)

PREFERRED:

• Hands on personality – production line focus personnel
• Good project planning, strong sense of quality and urgency
• Team player with good communication and interpersonal skills

SKILLS:

• JMP/Six Sigma/AutoCAD

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