- Reporting to management on progress toward goals, maintaining high-quality product deliveries to the customer by data analysis and yield analysis. Technically lead work packages within yield Improvement projects, decide on priorities, drive activities, analyze and present results with cross-function teams to solve technical and process issues.
- Analysis of Yield at assembly process & product Final Test to determine and resolve causes of low yield, identify/drive opportunities for improvement through structured problem-solving methodologies (e.g., 5Y, 8D, DMAIC)
- Develop and implement a quality control plan for adequacy and suitability for production and during new product introduction. Familiar with Control plan, OCAP, WI & FMEA
- Experienced working in Semiconductor process, especially in FOL Flip Chip process, Perform Yield enhancement activities, characterization, and test QDN reduction.
- Knowledgeable in production control processes, SPC, data Analysis/interpretation GR&R, Cp/Cpk and correlation analysis, MSA.
- Knowledge/Experience/hands-on in Datacon and underfill Asymtek machine much advantage.
- Fluency with Statistical analysis methodology/tools such as Root Cause Analysis, SPC, FMEA, Control Plans, and MSA (or Gauge R&R)
Qualification:
- Bachelor's Degree in an engineering discipline (electrical, mechanical & electronics)
- Minimum 1-2 years of Process/NPI working experience in semiconductor IC packaging.
Communication and Presentation:
- Fluent in English communication, additional language skills a plus. The job nature requires communicating with teams located in other region.
- Willing to work as a team and collaborate with other functional teams for discussion /problem-solving.
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